ASML
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ASML Holding N.V. is a Dutch semiconductor equipment company headquartered in Veldhoven, North Brabant, that is the sole global supplier of extreme ultraviolet (EUV) lithography systems used to fabricate leading-edge logic and memory chips.[1][2] The company reported total net sales of €32.7 billion and net income of €9.6 billion in fiscal year 2025, with EUV systems accounting for 48% of system revenue (€11.6 billion), and it employs more than 44,000 people worldwide.[1][3] ASML's customers include every advanced-node logic foundry and high-bandwidth memory manufacturer relevant to artificial intelligence accelerators, among them tsmc, Samsung Electronics, Intel Foundry, sk hynix, and Micron Technology; the chips that those customers print on ASML scanners power AI training and inference silicon from nvidia, AMD, apple, and Google (TPUs).[4][5] Its 2025 next-generation High-NA EUV system, the TWINSCAN EXE:5200B, sells for approximately US$350 million per unit and is required by Intel, TSMC and Samsung for sub-2 nm logic processes.[6][7] As of May 2026 ASML's market capitalization was approximately US$629 billion, making it one of the twenty most valuable listed companies in the world.[8]
ASML was incorporated on 1 April 1984 as ASM Lithography B.V., a joint venture between the Dutch consumer-electronics conglomerate Philips and ASM International (ASMI), a Dutch supplier of semiconductor production equipment.[9][10] Philips had developed lithography prototypes inside its physics laboratory in Eindhoven during the late 1970s and early 1980s, but by 1983 it concluded that finishing the project would require investments that did not fit the parent group's strategy of cutting capital expenditure.[9] The joint venture started with roughly 47 employees in a temporary wooden building next to Philips's Building TQ in Veldhoven; ASMI sold its half of the venture back to Philips in 1988, and ASML completed an initial public offering on the Amsterdam Stock Exchange and NASDAQ in March 1995.[9][11]
ASML's first product, the PAS 2000 stepper, was a commercial failure; the PAS 5500, a step-and-scan platform introduced in 1995, became the company's first volume product and was sold into every leading-edge fab of the late 1990s.[9][12] In 2001 ASML introduced the TWINSCAN architecture, a dual-stage scanner that measures one wafer while exposing another and shipped first as the TWINSCAN AT:1100.[12][13] The dual-stage concept remains the basis of every ASML scanner platform sold since, including the deep-ultraviolet TWINSCAN NXT, the EUV TWINSCAN NXE and the High-NA TWINSCAN EXE.[14]
In 2007 ASML overtook the Japanese supplier Nikon in lithography revenue, partly because its TWINSCAN immersion scanners, co-developed with TSMC, enabled the 45-nanometer node when competitive offerings could not.[9][15] Canon's lithography arm exited the leading edge entirely in the 2010s, leaving Nikon as the only other vendor still selling deep-ultraviolet scanners; neither Japanese vendor entered EUV development at production scale.[15]
EUV research at ASML began in 1999 with the LUSY (Lithography Using EUV-radiation SYstem) project, an internal program drawing on results from European and US laboratory consortia, including the EUV LLC effort coordinated by Intel, Motorola and AMD with US national laboratories.[16] ASML installed a research-grade EUV scanner, the Alpha Demo Tool, at IMEC in Leuven and at the College of Nanoscale Science and Engineering in Albany, New York, in 2006; the platform demonstrated 13.5-nanometer wavelength exposure but produced only a few wafers per hour.[16]
In 2010 ASML shipped the NXE:3100, its first commercial EUV exposure system, with an imaging resolution close to 20 nanometers; TSMC was the first dedicated foundry to install one for development at its Fab 12 in Hsinchu.[17] The NXE:3300, shipped from 2013, was the first EUV system designed for production but suffered from low source power and limited throughput.[18] To address the source problem ASML acquired the San Diego-based light-source vendor Cymer in 2013 for US$2.5 billion, bringing in-house the CO2 laser-driven tin-droplet plasma source.[19]
EUV transitioned from a research curiosity to a high-volume manufacturing tool in 2018-2019. TSMC began volume manufacturing of its 7-nanometer-plus (N7+) process using EUV in early 2019, and TSMC reserved 18 of the 30 EUV scanners ASML expected to ship that year.[20][21] Samsung introduced EUV on its 7LPP process in 2019, and Intel began ramping EUV at its 14A and 4 (formerly 7) nodes from 2021 onward.[22][23]
ASML and ZEISS Semiconductor Manufacturing Technology (ZEISS SMT) had begun designing the High-NA optical system in 2014 and announced an expanded strategic partnership in November 2016, with ASML taking a 24.9% minority stake in Carl Zeiss SMT for €1 billion in cash and committing to a multi-year High-NA development program.[24][25] The first High-NA system, the TWINSCAN EXE:5000, was assembled at ASML's Veldhoven facility in 2023 and shipped to Intel's Fab D1X in Hillsboro, Oregon, where Intel publicly confirmed assembly completion in April 2024; it was the first 0.55-NA EUV scanner ever installed at a chipmaker.[26][27] The production-grade TWINSCAN EXE:5200B followed in 2024-2025 and Intel had completed acceptance testing of its first EXE:5200B by mid-2025 for the company's 14A logic node.[28]
ASML's catalogue is built around three platforms: the deep-ultraviolet (DUV) TWINSCAN NXT line, the extreme-ultraviolet (EUV) TWINSCAN NXE line, and the High-NA EUV TWINSCAN EXE line.[14] DUV scanners remain ASML's largest product category by unit volume; EUV and High-NA EUV are its largest categories by revenue per system.[1]
The NXE family uses a projection lens with a numerical aperture of 0.33 and a 13.5-nanometer wavelength. The current production members are:
The High-NA EUV systems use a 0.55 numerical aperture projection optical column with anamorphic 8×4 demagnification, designed by Carl Zeiss SMT.[25][33] The optical column is approximately twice the size of the 0.33-NA NXE column and uses larger multilayer mirrors that operate at oblique angles to deliver an 8-nanometer resolution in a single exposure, eliminating the need for EUV double patterning at sub-2 nm nodes.[25][33]
Intel has stated publicly that it had processed 30,000 wafers on its EXE-class High-NA system by late 2024 in support of its 14A development.[34] TSMC ordered its first EXE-class system in 2024 for delivery in 2025 and plans to use High-NA EUV for its A14 (1.4 nm-class) process.[35]
The TWINSCAN NXT family uses argon-fluoride (ArF) excimer lasers at 193-nanometer wavelength, with water immersion lithography to improve resolution. Members include the NXT:2050i, NXT:2100i and NXT:2150i, used for layers that do not require EUV at logic nodes from 28 nm down through 5 nm and for memory.[36] List prices for current immersion DUV systems are reported in the US$60-90 million range per unit.[36] ASML also sells dry DUV systems (NXT:1980Di, NXT:1970Ci) and "i-line" tools for less critical layers.[14] DUV systems represented the majority of ASML's unit shipments in 2025; ASML sold 70% of its DUV lithography systems to Chinese entities in 2024 as customers stockpiled equipment ahead of further export restrictions.[37]
ASML's EUV light is produced by a laser-produced plasma (LPP) source designed and built by ASML's San Diego subsidiary Cymer, which ASML acquired in 2013.[19] A continuous stream of liquid-tin droplets, roughly 25 micrometers across, is delivered into a vacuum chamber at approximately 50,000 droplets per second.[38] Each droplet is hit twice by a high-power CO2 laser pulse from a TRUMPF amplifier chain: the first "pre-pulse" deforms the droplet into a flat disk, and the main pulse vaporizes it, producing a plasma at temperatures of approximately 220,000 °C that emits 13.5-nanometer EUV radiation.[38][39] Recent source modules deliver around 500 watts of in-band EUV power at intermediate focus, with ASML's roadmap targeting 1,000 watts to enable continued throughput scaling.[40]
The projection optics in every EUV system are built by Carl Zeiss SMT in Oberkochen, Germany, ASML's exclusive optics supplier.[25] Because no transmissive material is transparent to 13.5-nanometer light, EUV scanners use reflective optics: each mirror is coated with roughly 50 alternating molybdenum-silicon bilayers, deposited to atomic precision, that together act as a Bragg reflector with peak reflectivity around 70% at 13.5 nanometers.[25][41] The mirror substrates are made from ultra-low-expansion glass and polished to a surface figure with peak-to-valley deviation of less than 30 picometers, which ZEISS describes as the smoothest mirrors ever made.[25] In November 2016 ASML purchased a 24.9% stake in Carl Zeiss SMT for €1 billion in cash and committed to fund roughly €760 million of joint High-NA research and development over the following six years.[24]
Each photomask in an EUV scanner is protected from particle contamination by a pellicle, a thin polysilicon-based membrane suspended a few millimeters above the mask surface; ASML develops and manufactures EUV pellicles in-house from its Veldhoven and Wilton, Connecticut sites.[42] The pellicle must transmit EUV light with approximately 90% efficiency per pass while withstanding the heat load from a kilowatt-class source, and pellicle composition is one of the components covered by ASML's foundational EUV intellectual property.[42]
Both wafer and reticle stages in TWINSCAN systems use planar motors with magnetic levitation, achieving position accuracy on the order of sub-nanometer over a stage stroke of more than 300 millimeters.[14] The dual-stage architecture allows one wafer to be measured for alignment, focus and overlay using an off-axis interferometer-based metrology station while a second wafer is being exposed at the projection lens, eliminating measurement time from the critical path.[14] ASML co-develops its alignment, overlay and computational lithography software stack as the integrated "Holistic Lithography" portfolio, including the YieldStar standalone metrology platform.[14]
ASML's customer base is concentrated in five accounts that buy almost all of its leading-edge tools: TSMC, Samsung Electronics, Intel, SK hynix and Micron Technology.[4][5] Industry analysts in 2025 estimated that TSMC, Samsung and Intel together generate roughly 60% to 70% of ASML's revenue, with the remaining roughly 30% coming from memory makers, mainly SK hynix, Samsung's memory division and Micron, and from China-based customers buying mid-generation DUV.[5] Memory customers historically used DUV only, but EUV adoption in DRAM accelerated from 2023 onward, driven by HBM and high-density DDR5 products. SK hynix used EUV for its 1a nm DRAM and reported in 2024 that it was sourcing additional EUV scanners specifically for HBM expansion.[43]
The five top customers' geographic distribution shapes ASML's revenue mix. Taiwan was ASML's single largest country of destination in 2025 (driven by TSMC), followed by South Korea (Samsung, SK hynix), and the United States (Intel, Micron, and TSMC Arizona).[1] Chinese sales spiked to roughly 49% of revenue in the second quarter of 2024 as DUV stockpiling accelerated before tighter Dutch licensing rules, then fell back in 2025.[37] ASML's AI chip export controls exposure is therefore primarily on the DUV side: no EUV scanner has ever been shipped to mainland China, and ASML has stated this position in successive annual reports.[2][44]
The United States Commerce Department's Bureau of Industry and Security (BIS) and the US Department of Defense pressed the Dutch government to deny ASML an export license for its first planned EUV shipment to a Chinese customer (SMIC) in 2018-2019.[44][45] The Netherlands declined to renew the license in mid-2019, and no EUV system has been shipped to mainland China at any point since; ASML has repeatedly confirmed in shareholder filings that no EUV is installed in China.[44]
In October 2022 BIS issued a new Foreign Direct Product Rule covering advanced semiconductor manufacturing equipment, which initially applied a US extraterritorial reach to lithography. The Netherlands joined the controls in March 2023, requiring Dutch export licenses for the most advanced immersion DUV scanners (NXT:2000i and above) shipped to China.[46] In September 2024 the Dutch foreign trade and development minister, Reinette Klever, extended the Dutch licensing requirement to the TWINSCAN NXT:1970i and NXT:1980i, and also added a licensing requirement for service, spare parts and software updates supplied to previously delivered Chinese customers whose tools later came under restriction.[46][47] In late 2024 BIS further extended its own Foreign Direct Product Rule to capture additional DUV tools manufactured by ASML.[47]
In its January 2026 fiscal-year-2025 results call ASML stated that it expected the China revenue share to settle at approximately 25% of system sales by the end of 2026, down from a peak of 49% in the second quarter of 2024.[1][3] In May 2026 Dutch Prime Minister Dick Schoof said in public remarks that the Netherlands expected the US administration to continue to press for tighter restrictions on ASML's China-bound shipments.[48] ASML has consistently described the export-control regime in its disclosures as a meaningful headwind on China revenue but immaterial to overall demand, because production capacity for its scanners is already booked years in advance by non-Chinese leading-edge customers.[1][3]
ASML reported total net sales of €32.7 billion in fiscal year 2025, up 15% from €28.3 billion in fiscal year 2024, with a gross margin of 52.8% and net income of €9.6 billion.[1] System sales were €24.0 billion and installed-base management (service, upgrades, parts) was €8.7 billion.[1] Within system sales, EUV systems contributed €11.6 billion (48% of system revenue) on 48 EUV system shipments, up from 38% in 2024.[1] Performance obligations (the equivalent of order backlog) stood at €46.5 billion at year-end 2025, of which the company described a large share as covering EUV and immersion DUV shipments through 2030.[1]
Research and development expense was €4.7 billion in 2025, supporting roughly 16,000 R&D staff across Veldhoven, Wilton (Connecticut), San Diego (Cymer) and Linkou (Taiwan).[1] The company guided in January 2026 that 2026 net sales would land between €36 billion and €40 billion at a gross margin between 51% and 53%, an upward revision from the prior guidance issued in 2025.[49] In its first quarter ending 30 March 2026 the company reported total net sales of €8.8 billion, gross margin of 53.0%, operating margin of 36.0% and net income of €2.8 billion.[49] ASML's stated long-term financial model targeted revenue of approximately US$71 billion by 2030 on continued EUV and High-NA expansion.[50]
ASML pays a dividend, which the company increased by 17% for 2025 to €7.50 per ordinary share, paid in installments through 2026.[49] The company is listed on Euronext Amsterdam (ASML) and on NASDAQ (ASML), with ASML.AS trading at approximately €1,345 in May 2026 and the company carrying an implied market capitalization of approximately US$629 billion as of 22 May 2026.[8] At that valuation ASML was the most valuable listed company in continental Europe and the most valuable semiconductor equipment company in the world by a wide margin.[8]
ASML employed more than 44,000 people on a full-time equivalent basis at the end of 2025, more than half of whom worked at the Veldhoven headquarters in North Brabant, the Netherlands.[51] The Veldhoven site comprises the global head office, the main EUV and High-NA assembly halls, and a large share of the R&D organization.[51] Other major sites include Wilton, Connecticut (DUV optics and reticle handling); San Diego, California (Cymer light source); Berlin, Germany (mechatronic modules); Linkou, Taiwan (regional support hub for TSMC and other Taiwan customers); and Hwaseong, South Korea (regional hub for Samsung and SK hynix).[51] The company runs apprenticeship and university partnership programs with TU Eindhoven and Delft University of Technology to staff its mechanical engineering, optics and software functions, an arrangement the company has cited as a structural advantage given the small global pool of semiconductor equipment engineers.[9][51]
ASML is the only company in the world that produces EUV lithography systems; the only other firms still active in semiconductor lithography for advanced nodes are the Japanese vendors Nikon and Canon, both of which sell only deep-ultraviolet (DUV) systems and have not announced commercial EUV programs.[15] As of 2026 ASML had a 100% share of EUV scanner shipments, an estimated 90%-plus share of immersion DUV shipments at the leading edge, and majority share of older DUV.[15][52] Industry analysts attribute ASML's monopoly position to three structural advantages: the exclusive partnership with Carl Zeiss SMT for projection optics, ownership of Cymer for the EUV light source, and a fifteen-year head start in productive EUV measured from the 2010 NXE:3100 first ship through the 2025 EXE:5200B.[53] Chinese efforts to build domestic DUV (notably by SMEE, the Shanghai Micro Electronics Equipment vendor) and Chinese-led EUV research (reported by the Harbin Institute of Technology in 2024) had not produced production-grade equipment as of 2026.[52][53] Chris Miller's 2022 history of the semiconductor industry, "Chip War", described ASML as "the most important company that almost no one had heard of" and traced ASML's pole position to a long sequence of US government-funded EUV research transferred under licensing to ASML in the 1990s and 2000s.[54]