3D NAND
3D NAND is the vertical architecture that NAND flash memory adopted when shrinking cells sideways stopped working.
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AI Accelerator
An AI accelerator is hardware designed or configured to execute artificial intelligence and machine learning workloads more efficiently than a general-purpose processor executing the same workload without…
AI Accelerator Comparison (H100 vs B200 vs MI300 vs TPU)
As of July 2026, the best AI accelerator depends on the metric you care about, so the honest answer to "H100 vs B200 vs MI300 vs TPU" is not a single winner.
AI Chip
An AI chip is an integrated circuit, or a tightly integrated multi-die semiconductor package, designed or selected to execute artificial intelligence workloads efficiently.
AMD Advancing AI 2026
Advancing AI 2026 (styled AAI 2026 in the company's own materials) was an annual product and strategy conference held by AMD in San Francisco on July 22 and 23, 2026.
AMD Helios
AMD Helios is a rack-scale artificial intelligence system from AMD that packages 72 Instinct MI455X GPUs and 18 sixth-generation EPYC "Venice" CPUs into a single double-wide cabinet
AMD Instinct MI300X
The AMD Instinct MI300X is a data center GPU accelerator that Advanced Micro Devices released on December 6, 2023, built on the CDNA 3 architecture and paired with 192 GB of HBM3 memory at 5.3 TB/s of bandwidth
AMD Instinct MI325X
The AMD Instinct MI325X is a data center GPU accelerator from AMD for AI training and inference, built on the CDNA 3 architecture with 256 GB of HBM3E memory and 6 TB/s of memory bandwidth
AMD Instinct MI355X
The AMD Instinct MI355X is a data center GPU accelerator built on AMD's CDNA 4 architecture, announced at the AMD Advancing AI 2025 event on June 12, 2025, and reaching general availability in October 2025.
AMD Instinct MI430X
The AMD Instinct MI430X is a data center GPU accelerator built for scientific computing and sovereign AI, and the high-precision member of the AMD Instinct MI400 series.
AMD Instinct MI455X
The AMD Instinct MI455X is a data center GPU accelerator announced by AMD on 23 July 2026 at Advancing AI 2026 in San Francisco.
AMD Pensando
AMD Pensando is the data processing unit (DPU) and AI networking product line of AMD, built around Pensando Systems, a startup AMD acquired in 2022 in a transaction valued at approximately $1.9 billion .
AWS Graviton
AWS Graviton is a family of Arm-based server processors designed by Amazon Web Services for use in its own cloud computing fleet.
AWS Trainium
AWS Trainium is a family of custom machine learning accelerator chips designed by Annapurna Labs for Amazon Web Services, purpose-built for training and, increasingly, for serving large neural networks.
AWS Trainium 2
AWS Trainium 2 (also written as Trainium2 and abbreviated Trn2) is the second generation of Amazon Web Services' custom machine learning training accelerator
AWS Trainium 3
AWS Trainium 3 (also written as Trainium3 and abbreviated Trn3) is the third-generation custom AI training and inference accelerator from Amazon Web Services, designed by Amazon's in-house chip team Annapurna…
Blackhole (Tenstorrent)
Blackhole is the third-generation AI accelerator architecture from Tenstorrent, the Toronto and Santa Clara based fabless semiconductor company led by CEO Jim Keller.
Broadcom Tomahawk 6
The Broadcom Tomahawk 6 is an Ethernet switch chip built for the networks that connect large clusters of AI accelerators.
CHIPS and Science Act
The CHIPS and Science Act is a United States federal law, enacted as Public Law 117-167 on August 9, 2022, that appropriated $52.7 billion for domestic semiconductor manufacturing, research, and workforce…
CME Compute Futures
CME Compute Futures are a planned family of financially settled futures contracts tied to Silicon Data benchmarks for hourly rentals of Nvidia H100 and B200 graphics processors.
Central processing unit
A central processing unit (CPU) is the general-purpose processor that executes a computer's instruction stream.
Cerebras WSE-3
The Cerebras WSE-3 (Wafer-Scale Engine 3) is the third-generation wafer-scale AI chip developed by Cerebras Systems, announced on March 13, 2024, and is the largest semiconductor ever built.
China's semiconductor industry
China's semiconductor industry is the network of wafer fabrication plants, equipment and materials suppliers, chip design houses, packaging and test operations, and state investment vehicles that produce…
Cloud AI GPU Pricing Comparison
Cloud AI GPU pricing is difficult to compare from a headline hourly rate alone. Providers sell different GPU variants, node sizes, CPU and memory bundles, regions, network configurations, and purchase models.
Cloud TPU
Cloud TPU is Google Cloud's offering of Tensor Processing Units (TPUs), the family of custom application-specific integrated circuits (ASICs) that Google builds to accelerate machine learning training and…
Cloud computing
Cloud computing is the on-demand availability of computer system resources, especially data storage and computing power, delivered over the internet without active management by the end user.
Co-Packaged Optics
Co-packaged optics (CPO) is a hardware architecture that places active optical engines on the same first-level package substrate as a host application-specific integrated circuit (ASIC).
DRAM (Dynamic Random-Access Memory)
Dynamic random-access memory (DRAM) is the working memory of nearly every computer built since the late 1970s, and the physical substrate on which modern AI hardware runs.
Data Center
A data center is a purpose-built facility, or a dedicated part of a facility, that houses and interconnects information technology and telecommunications equipment together with the power…
Edge computing
Edge computing is a distributed computing paradigm that runs computation and data storage close to where data is generated, at the "edge" of the network
Ethernet
Ethernet is the family of wired computer networking technologies standardized by the IEEE 802.3 working group.
FPGA
A field-programmable gate array (FPGA) is an integrated circuit whose logic functions and internal wiring are set by the customer after the chip has been manufactured, and can be reset later.
Frozen v2 (Google AI chip)
Frozen v2 is the informal internal codename for a specialized artificial-intelligence inference chip that Google is reportedly developing to run its Gemini models more cheaply and with far less energy.
GPU Cluster
A GPU cluster is a group of servers containing graphics processing units that are connected by high-bandwidth, low-latency networks and operated as one computational pool.
GPU computing
GPU computing is the use of a graphics processing unit (GPU) to perform general-purpose computation that was traditionally handled by the central processing unit (CPU).
Google Axion
Google Axion is Google's first custom Arm-based central processing unit designed for the data center.
Groq Hardware
Groq hardware is a family of artificial-intelligence accelerators and multi-chip systems built around a statically scheduled streaming architecture.
Huawei Ascend
Huawei Ascend is a family of AI accelerators designed by Huawei around a custom processor architecture called Da Vinci.
Huawei Ascend 910B
The Huawei Ascend 910B is a data-center AI accelerator designed by Huawei's HiSilicon unit that became China's most widely deployed domestic alternative to restricted NVIDIA data-center GPUs across roughly…
Huawei Ascend 910C
The Huawei Ascend 910C is a data-center artificial intelligence accelerator developed by Huawei and positioned as China's leading domestic alternative to high-end NVIDIA GPUs that are barred from sale to…
Hyperscaler
A hyperscaler is a company that builds and operates computing infrastructure at a scale far beyond a conventional enterprise IT estate: globally distributed fleets of data centers holding millions of servers…
InfiniBand
InfiniBand is a high throughput, low latency networking interconnect standard used to connect servers, storage, and accelerators inside high performance computing systems and large artificial intelligence…
Internet of Things
The Internet of Things (IoT) is the network of physical objects ("things") embedded with sensors, software, and connectivity that lets them collect data, exchange it with other devices and systems over the…
Jalapeño (OpenAI chip)
Jalapeño is a custom AI accelerator designed by OpenAI with silicon implementation and networking technology from Broadcom.
Kioxia
Kioxia is a Japanese flash memory manufacturer, the direct corporate descendant of the Toshiba division where flash memory was invented in the 1980s.
Lenovo
Lenovo Group Limited is a Chinese multinational technology company that is the world's largest personal computer vendor by unit shipments and one of the largest builders of AI-optimized data center hardware…
MTIA
MTIA (Meta Training and Inference Accelerator) is a family of custom silicon chips that Meta designs for use in its own data centers rather than for sale.
MediaTek
MediaTek Inc. is a Taiwanese fabless semiconductor company headquartered in Hsinchu, Taiwan.
Meta MTIA
MTIA (Meta Training and Inference Accelerator) is a family of custom AI chips that Meta designs in-house to run its largest artificial intelligence workloads, beginning with the deep learning recommendation…
Microscaling formats
Microscaling (MX) formats are a family of low-precision number formats for machine learning in which a small block of values, normally 32 of them, shares one common scale factor while each value is stored in a…
Microsoft Maia 200
Microsoft Maia 200 is a custom artificial intelligence accelerator designed by Microsoft for inference workloads in the Azure cloud.
NAND flash memory
NAND flash memory is the non-volatile storage technology that holds the data in solid-state drives, memory cards, USB sticks, phones and the flash tiers of a modern data center.
NCCL (NVIDIA Collective Communications Library)
NCCL, the NVIDIA Collective Communications Library, is a library of topology-aware communication primitives for NVIDIA GPU systems.
NVHBM
NVHBM is an announced custom high-bandwidth memory architecture from NVIDIA for custom AI accelerators that participate in the company's NVLink Fusion platform. NVIDIA introduced it on August 26, 2026.
NVIDIA B200
The NVIDIA B200 is a data center GPU based on the NVIDIA Blackwell microarchitecture, announced by Jensen Huang at GTC 2024 on March 18, 2024.
NVIDIA ConnectX
NVIDIA ConnectX is a family of high-speed network adapters and SmartNICs (smart network interface cards) that connect a server to the data center fabric and accelerate networking in hardware.
NVIDIA DGX B300
The NVIDIA DGX B300 is an 8-GPU AI supercomputer node built around NVIDIA's Blackwell Ultra architecture.
NVIDIA DGX Station
NVIDIA DGX Station is a line of deskside artificial intelligence workstations from NVIDIA, each marketed as a "personal AI supercomputer" that puts data-center-class compute next to a developer's desk rather…
NVIDIA GB300 NVL72
The NVIDIA GB300 NVL72 is a liquid-cooled, rack-scale AI computing system that integrates 72 NVIDIA Blackwell Ultra (B300) GPUs and 36 Arm-based NVIDIA Grace CPUs into a single NVLink fabric, delivering 1.1…
NVIDIA GH200 Grace Hopper Superchip
The NVIDIA GH200 Grace Hopper Superchip is a single-module processor from NVIDIA that combines a 72-core Grace Arm CPU with a Hopper-generation H100-class GPU on one package